原装进口松下耐高温芯片倒装底填胶CV5300AK01EPS
Liquid encapsulant materials
CV5300AK
TECHNICAL INFORMATION
This is one component epoxy for Flip-chip underfilling.
RECOMMENDING PREHEAT CONDITION
temperature of substrate : 80～120oC
temperature of syringe : R.T.～ 60oC
ATTENTION TO STORAGE
・Stored compound must be thawed before use. Warm at room temperature until no longer cool to touch (about 2hrs).
・Please use up the material within 12 hrs.
・Compound must be stored in the cool condition with sealing.
・Please keep material under -40oC after receiving product.
ATTENTION TO HANDLING
・Please avoid direct contact with this product by wearing gloves, protecting gears,etc.
・Prevent frequent skin contact. If contact occurs, wash immediately with soap and water.
原装进口松下耐高温芯片倒装底填胶CV5300AK01EPS
