汉高乐泰UF3810 ** ECCOBOND UF3810 LOCITTE UF3810

新包装乐泰UF3810  原装**乐泰UF3810 代理乐泰UF3810胶水销售联系：137.511.6332陈生 Q/Q.30.222.4564.

** ECCOBOND UF 3810 reworkable epoxy underfill is

designed for CSP and BGA applicati**. It cures quickly at moderate

temperatures to minimize stress to other components. When cured,

this material provides excellent mechanical properties to protect solder

joints during thermal cycling.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Cone & Plate, @ 25 °C , mPa?s (cP):

优势乐泰UF3810  供应  原装**乐泰UF3810  深圳乐泰UF3810  上海乐泰UF3810