铜箔胶带
1.材質說明 (Material Data) | ||||||||||
項目 (Item) | 材質 (Material) | 厚度 (Thickness) | 說明 (Description) | |||||||
基材(Base Material) | 銅箔(Copper Foil) | 0.018±0.005mm | 99.95% | |||||||
膠體(Adhesive) | 導電膠(Conductive Acrylic Adhesive) | 0.035±0.005mm | 感壓性膠(Pressure Sensitive Adhesive) | |||||||
2.特性(Characteristics) | ||||||||||
項目 (Item) | 單位(Unit) | 測試值(Value) | 說明(Description) | |||||||
粘著力(Adhesive Strength with 180° Peel) | Kgf | ≧0.8 | 在25℃以2Kg/inch貼合測試貼合後靜置20分鐘,再以180°反向拉張速度300mm/min | |||||||
保持力(Holding Power) | minute | ≧1440 | 對SUS 304 Plate以2Kg/inch貼合測試 | |||||||
表面阻抗 (Surface Resistance) | Ω | ≦0.05 | 25.4mmX25.4mm Mitsubishi Loresta阻抗測試機 | |||||||
屏蔽效果 (Shielding Effectiveness) | dB | 55~88 | 100MHz~1000MHz |